Capabilities

•  Maximum Layers

•  Maximum Board Dimensions

•  Maximum Board Thickness

•  Minimum Board Thickness

•  Minimum Trace Width

•  Minimum Space Width

•  Minimum Hole Size

•  Maximum Inner Copper

•  Maximum Outer Copper

40

20” x 40”

0.300” +

0.001”

0.003”

0.003”

0.004”

6 oz

16 oz

•  IPC-A-600

•  IPC-6012/6013

•  Bow and Twist

•  Pad Size Deviation

•  Registration Deviation

•  Via Fill/Plugged Vias

•  Blind & Buried Vias

•  Controlled Impedance

•  Embedded Resistance

Class 2 & 3

Class 2, 3 & 3/A

IPC-TM-650

± 10%

0.0015”

Supported

Supported

Supported

Supported

•  FR-2 | FR-4

•  FR-4 (Tg 170° – 220°)

•  CEM-1 | CEM-3

•  Polyimide (Rigid)

•  Polyimide (Flex)

•  PTFE

•  Adhesiveless

•  Aluminum

•  BT-Epoxy

 

•  Kapton® (All Types)

•  Teflon® (All Types)

•  Rogers® (All Types)

•  Taconic® (All Types)

•  Ventec® (All Types)

•  Nelco® (All Types)

•  Arlon® (All Types)

•  Isola® (All Types)

•  Plus Many More!

•  HASL

•  HASL (Lead-Free)

•  ENIG

•  ENEPIG

•  Nickel Plating

•  Hard Gold

•  Flash Gold

•  Wire Bondable Gold

•  Selective Gold Plating

 

•  Silver Immersion

•  Tin Immersion

•  Tin-Lead Plating

•  Tin-Nickel Plating

•  Carbon

•  OSP

•  SMOBC

•  PISM

•  LPISM

 

Have any questions regarding our capabilities? Send us a message and one of our engineers will get back to you within 24 hours!