• Maximum Layers
• Maximum Board Dimensions
• Maximum Board Thickness
• Minimum Board Thickness
• Minimum Trace Width
• Minimum Space Width
• Minimum Hole Size
• Maximum Inner Copper
• Maximum Outer Copper
40
20” x 40”
0.300” +
0.001”
0.003”
0.003”
0.004”
6 oz
16 oz
• IPC-A-600 Class
• IPC-6012/6013
• Bow and Twist
• Pad Size Deviation
• Registration Deviation
• Plugged Vias/Via Fill
• Blind & Buried Vias
• Controlled Impedance
• Embedded Resistance
Class 2, & 3
Class 2, 3, & 3/A
IPC-TM-650
± 10%
0.0015”
Supported
Supported
Supported
Supported
• FR-2 | FR-4
• FR-4 (Tg 170° – 220°)
• CEM-1 | CEM-3
• Polyimide (Rigid)
• Polyimide (Flex)
• PTFE
• Adhesiveless
• Aluminum
• BT-Epoxy
• Kapton® (All Types)
• Teflon® (All Types)
• Rogers® (All Types)
• Taconic® (All Types)
• Ventec® (All Types)
• Nelco® (All Types)
• Arlon® (All Types)
• Isola® (All Types)
• Plus Many More!
• HASL
• HASL (Lead-Free)
• ENIG
• ENEPIG
• Nickel Plating
• Hard Gold
• Flash Gold
• Wire Bondable Gold
• Selective Gold Plating
• Silver Immersion
• Tin Immersion
• Tin-Lead Plating
• Tin-Nickel Plating
• Carbon
• OSP
• SMOBC
• PISM
• LPISM